Description
PIC16(L)F15325/45 microcontrollers feature Analog, Core Independent Peripherals and Communication Peripherals, combined with eXtreme Low-Power (XLP) technology for a wide range of general purpose and low-power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
Specifications: | |
Attribute | Value |
Category | Integrated Circuits (ICs) |
Embedded - Microcontrollers | |
Mfr | Microchip Technology |
Series | PIC® XLP™ 16F |
Package | Tube |
Part Status | Active |
Core Processor | PIC |
Core Size | 8-Bit |
Speed | 32MHz |
Connectivity | I²C, LINbus, SPI, UART/USART |
Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
Number of I/O | 18 |
Program Memory Size | 14KB (8K x 14) |
Program Memory Type | FLASH |
EEPROM Size | - |
RAM Size | 1K x 8 |
Voltage - Supply (Vcc/Vdd) | 2.3V ~ 5.5V |
Data Converters | A/D 17x10b; D/A 1x5b |
Oscillator Type | Internal |
Operating Temperature | -40°C ~ 125°C (TA) |
Mounting Type | Surface Mount |
Package / Case | 20-SOIC (0.295", 7.50mm Width) |
Supplier Device Package | 20-SOIC |
Base Product Number | PIC16F15345 |